The machine for the micrograph W 200 is a machine designed and built to perform the monitoring of the proper compaction of copper after crimping of cable.
It has a knob for cutting in safety of the terminal crimped, by a disc of sandpaper for cleaning the cutting and by a microscope complete with software to interface with the computer.
It has a knob for cutting in safety of the terminal crimped, by a disc of sandpaper for cleaning the cutting and by a microscope complete with software to interface with the computer.
• Dimension: W500 x H250 x D400 mm
• Weight: 22 Kg
• Power supply: 230 V
• Frequency: 50/60 Hz
• Disk cut diameter: 32 mm
• Thickness disk cut: 0,7 mm
• Velcro abrasive disk diameter: 150 mm
• Type disk abrasive: SCS
• Graded disk: 320
• Camera resolution: 1280×1024 pixel
• Weight: 22 Kg
• Power supply: 230 V
• Frequency: 50/60 Hz
• Disk cut diameter: 32 mm
• Thickness disk cut: 0,7 mm
• Velcro abrasive disk diameter: 150 mm
• Type disk abrasive: SCS
• Graded disk: 320
• Camera resolution: 1280×1024 pixel